@inproceedings{aa4235e529db470886f5b94317227caf,
title = "Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology",
abstract = "For realizing low-cost miniaturized 2.5D/3.5D integration, this paper presents scalable embedded multi-die active bridge (S-EMAB) chips with integrated LDOs to provide on-demand I/O routing capability and in-package voltage regulation among multiple dies or chiplets. Each S-EMAB chip is a programmable bridge and implemented by an I/O array and MUX I/Os to support various transmission interfaces. The data rate of I/O array are from 50Mbps to 1Gbps, and MUX I/Os can reach to 8Gbps. Moreover, the number of programmable I/O links can be scaled up by connecting multiple S-EMAB chips in a daisy chain without extra control pins. In addition to miniaturization, LDOs are further integrated in S-EMAB chips to eliminate external LDOs. The proposed work is a fast time-to-market, low-cost, flexible, and miniaturized 3.5D integration solution for various IoT applications.",
author = "Wei Lu and Jie Zhang and Wei, {Yi Hui} and Hsiao, {Hsu Ming} and Li, {Sih Han} and Hsu, {Chao Kai} and Hsiao, {Chih Cheng} and Lo, {Feng Hsiang} and Sheu, {Shyh Shyuan} and Wang, {Chin Hung} and Lo, {Wei Chung} and Chang, {Shih Chieh} and Chen, {Hung Ming} and Chen, {Kuan Neng} and Huang, {Po Tsang}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024 ; Conference date: 16-06-2024 Through 20-06-2024",
year = "2024",
doi = "10.1109/VLSITechnologyandCir46783.2024.10631526",
language = "English",
series = "Digest of Technical Papers - Symposium on VLSI Technology",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024",
address = "美國",
}