Sacrificial mold embossing for high density, high aspect ratio micro/nano structures

Chunmeng Lu*, David Grewell, Avraham Benator, L. James Lee

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

An unconventional embossing method is evaluated in which de-embossing is avoided to prevent the deformation or damage of the polymer microstructure on the substrate due to one or more of the following issues involved in hot embossing process: higher feature density, higher aspect ratio, bad surface quality and under-cuts. In this study, a PDMS mold is used to transfer a SU-8 structure to a water-soluble polymeric stamp under low pressure and low temperature, which is used as the rigid tool in the following hot embossing and can be reused by being dissolved in water, an environmentally benign solvent. This method has potential uses in the replication of high aspect ratio microstructure on polymeric materials that cannot be easily achieved using other methods.

Original languageEnglish
Pages2561-2565
Number of pages5
StatePublished - 2006
EventSociety of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006 - Charlotte, NC, United States
Duration: 7 May 200611 May 2006

Conference

ConferenceSociety of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006
Country/TerritoryUnited States
CityCharlotte, NC
Period7/05/0611/05/06

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