Routing algorithm design for power- and temperature-aware NoCs

Kun Chih (Jimmy) Chen, Masoumeh Ebrahimi

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

The Network-on-Chip (NoC) interconnection is a popular way to build up contemporary large-scale multi-processor System-on-Chip (MPSoC) systems. However, due to the high integration density with high operation frequency, the larger power density leads to serious temperature problems. The thermal issue limits the performance and results in higher leakage power and lower system reliability. The thermal and power issues become worsen in the modern 3D stacking NoC structure and become the primary design challenge. In this chapter, we first investigate the correlation between power and temperature in NoC systems and introduce a thermal model for such systems. With this thermal model, we introduce novel routing design methodologies for power- and temperature-aware NoCs by using Game theory and reinforcement learning.

Original languageEnglish
Title of host publicationPower-Efficient Network-on-Chips
Subtitle of host publicationDesign and Evaluation
EditorsAli R. Hurson, Hamid Sarbazi-Azad, Hamid Sarbazi-Azad
PublisherAcademic Press Inc.
Pages117-150
Number of pages34
ISBN (Print)9780323856881
DOIs
StatePublished - Jan 2022

Publication series

NameAdvances in Computers
Volume124
ISSN (Print)0065-2458

Keywords

  • 2D/3D NoC
  • Networks-on-Chip
  • Power consumption
  • Regular/irregular NoC
  • Routing algorithms
  • Temperature

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