RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

Yu Tao Yang, Haoxiang Ren, Su Kong Chong, Gang Qiu, Shu Yun Ku, Yang Cheng, Chaowei Hu, Tiema Qian, Kuan Neng Chen, Ni Ni, Kang L. Wang, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To preserve delicate quantum signals (few hundreds to a few tens of μV), low-loss and low-crosstalk inter-dielet communication is a must in a wafer-scale integrated quantum system using Superconducting-IF. In this paper, inter-dielet links (short: 125 μm and 500 μm; long: 1750 μm) with L/S (2/2 and 5/5 μm) are characterized in a broadband 20 GHz range through simulation and experiments at 4K A compact assembly (inter-dielet spacing of 100 μm) through the quantum-compatible fine-pitch (10 um) Au interlayer is conducted. For insertion loss and crosstalk characterization, the simulated and measured results are presented to be low-loss (<1 dB) and low-crosstalk (< -23 dB) in the broadband 20 GHz range with short (≤ 500 um) and long (1750 um) links and two L/S (2/2 and 5/5 um). It is one of the first 20 GHz broadband RF characterization of short superconducting links (≤ 500 um) through advanced packaging for cryogenic inter-dielet quantum communication. This work brings large-scale quantum computing closer to being realized through compact heterogeneous integration.

Original languageEnglish
Title of host publicationProceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages949-955
Number of pages7
ISBN (Electronic)9781665479431
DOIs
StatePublished - 2022
Event72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, United States
Duration: 31 May 20223 Jun 2022

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2022-May
ISSN (Print)0569-5503

Conference

Conference72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Country/TerritoryUnited States
CitySan Diego
Period31/05/223/06/22

Keywords

  • Au interlayer
  • heterogeneous integration
  • Superconducting Silicon Interocnnect Fabric

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