Reshaping System Design in 3D Integration: Perspectives and Challenges

Hung Ming Chen; Chu Wen Ho; Shih Hsien Wu; Wei Lu; Po Tsang Huang; Hao Ju Chang; Chien Nan Jimmy Liu

doi:10.1145/3569052.3578918

Reshaping System Design in 3D Integration: Perspectives and Challenges

Hung Ming Chen, Chu Wen Ho, Shih Hsien Wu, Wei Lu, Po Tsang Huang, Hao Ju Chang, Chien Nan Jimmy Liu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.

Original language	English
Title of host publication	ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design
Publisher	Association for Computing Machinery
Pages	71-77
Number of pages	7
ISBN (Electronic)	9781450399784
DOIs	https://doi.org/10.1145/3569052.3578918
State	Published - 26 Mar 2023
Event	32nd ACM International Symposium on Physical Design, ISPD 2023 - Virtual, Online, United States Duration: 26 Mar 2023 → 29 Mar 2023

Publication series

Name	Proceedings of the International Symposium on Physical Design

Conference

Conference	32nd ACM International Symposium on Physical Design, ISPD 2023
Country/Territory	United States
City	Virtual, Online
Period	26/03/23 → 29/03/23

Keywords

3D Integration
3D interconnection architecture
D2D design
Fast system prototyping

Access to Document

10.1145/3569052.3578918

Cite this

Chen, H. M., Ho, C. W., Wu, S. H., Lu, W., Huang, P. T., Chang, H. J., & Liu, C. N. J. (2023). Reshaping System Design in 3D Integration: Perspectives and Challenges. In ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design (pp. 71-77). (Proceedings of the International Symposium on Physical Design). Association for Computing Machinery. https://doi.org/10.1145/3569052.3578918

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title = "Reshaping System Design in 3D Integration: Perspectives and Challenges",

abstract = "In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.",

keywords = "3D Integration, 3D interconnection architecture, D2D design, Fast system prototyping",

author = "Chen, {Hung Ming} and Ho, {Chu Wen} and Wu, {Shih Hsien} and Wei Lu and Huang, {Po Tsang} and Chang, {Hao Ju} and Liu, {Chien Nan Jimmy}",

note = "Publisher Copyright: {\textcopyright} 2023 ACM.; 32nd ACM International Symposium on Physical Design, ISPD 2023 ; Conference date: 26-03-2023 Through 29-03-2023",

year = "2023",

month = mar,

day = "26",

doi = "10.1145/3569052.3578918",

language = "English",

series = "Proceedings of the International Symposium on Physical Design",

publisher = "Association for Computing Machinery",

pages = "71--77",

booktitle = "ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design",

}

Chen, HM, Ho, CW, Wu, SH, Lu, W, Huang, PT, Chang, HJ & Liu, CNJ 2023, Reshaping System Design in 3D Integration: Perspectives and Challenges. in ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Proceedings of the International Symposium on Physical Design, Association for Computing Machinery, pp. 71-77, 32nd ACM International Symposium on Physical Design, ISPD 2023, Virtual, Online, United States, 26/03/23. https://doi.org/10.1145/3569052.3578918

Reshaping System Design in 3D Integration: Perspectives and Challenges. / Chen, Hung Ming; Ho, Chu Wen; Wu, Shih Hsien et al.
ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, 2023. p. 71-77 (Proceedings of the International Symposium on Physical Design).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Chen, Hung Ming

AU - Ho, Chu Wen

AU - Wu, Shih Hsien

AU - Lu, Wei

AU - Huang, Po Tsang

AU - Chang, Hao Ju

AU - Liu, Chien Nan Jimmy

PY - 2023/3/26

Y1 - 2023/3/26

N2 - In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.

AB - In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.

KW - 3D Integration

KW - 3D interconnection architecture

KW - D2D design

KW - Fast system prototyping

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U2 - 10.1145/3569052.3578918

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BT - ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design

PB - Association for Computing Machinery

Y2 - 26 March 2023 through 29 March 2023

ER -

Reshaping System Design in 3D Integration: Perspectives and Challenges

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Publication series

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Keywords

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