Research of electroplating and electroless plating for low temperature bonding in 3D heterogeneous integration

Yu Chen Hu, Yao Jen Chang, Chun Shen Wu, Yung Mao Cheng, Wei Jen Chen, Kuan Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Fingerprint

Dive into the research topics of 'Research of electroplating and electroless plating for low temperature bonding in 3D heterogeneous integration'. Together they form a unique fingerprint.

Engineering & Materials Science