Reliability of high power semiconductor lasers on bonding and mounting design

Yu Chen Chen, Kuo-Jui Lin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations


Reliability of high-power semiconductor lasers can be underestimated because of imperfect bonding and improper mounting. The C-mount package of Cu material is replaced with CuW material and high power laser chips are bonded above without AlN submount. For the burn-in test, liquid-metal alloy is applied between C-mount and heatsink to improve thermal contact. The estimated lifetime of 4 W, 808 nm lasers is therefore greatly increased to over 3600 hours.

Original languageEnglish
Title of host publication2015 Optoelectronics Global Conference, OGC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467377324
StatePublished - 29 Aug 2015
EventOptoelectronics Global Conference, OGC 2015 - Shenzhen, China
Duration: 29 Aug 201531 Aug 2015

Publication series

Name2015 Optoelectronics Global Conference, OGC 2015


ConferenceOptoelectronics Global Conference, OGC 2015


  • eutectic bonding
  • high power lasers
  • lifetime
  • reliability
  • thermal resistance


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