@inproceedings{588d6244f11c45c6a6ae5475e8bfa052,
title = "Reliability of high power semiconductor lasers on bonding and mounting design",
abstract = "Reliability of high-power semiconductor lasers can be underestimated because of imperfect bonding and improper mounting. The C-mount package of Cu material is replaced with CuW material and high power laser chips are bonded above without AlN submount. For the burn-in test, liquid-metal alloy is applied between C-mount and heatsink to improve thermal contact. The estimated lifetime of 4 W, 808 nm lasers is therefore greatly increased to over 3600 hours.",
keywords = "eutectic bonding, high power lasers, lifetime, reliability, thermal resistance",
author = "Chen, {Yu Chen} and Kuo-Jui Lin",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; Optoelectronics Global Conference, OGC 2015 ; Conference date: 29-08-2015 Through 31-08-2015",
year = "2015",
month = aug,
day = "29",
doi = "10.1109/OGC.2015.7336834",
language = "English",
series = "2015 Optoelectronics Global Conference, OGC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2015 Optoelectronics Global Conference, OGC 2015",
address = "美國",
}