Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang; Fu Hsin Chen; Meng Yen Chen; Yew-Chuhg Wu

doi:10.1149/2.0071509jss

Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang, Fu Hsin Chen, Meng Yen Chen, Yew-Chuhg Wu

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

Original language	English
Pages (from-to)	R140-R143
Journal	ECS Journal of Solid State Science and Technology
Volume	4
Issue number	9
DOIs	https://doi.org/10.1149/2.0071509jss
State	Published - 2015

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title = "Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder",

abstract = "High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.",

author = "Chang, {Tai Min} and Chen, {Fu Hsin} and Chen, {Meng Yen} and Yew-Chuhg Wu",

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AU - Chang, Tai Min

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AU - Chen, Meng Yen

AU - Wu, Yew-Chuhg

PY - 2015

Y1 - 2015

N2 - High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

AB - High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

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Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

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