Abstract
Effects of hot phosphorus (P) implantation on the NiGe-contacted Ge n+/p junction are studied in this work. At an adequately high ion-implantation temperature (150°C), the P depth profiles of the hot-implanted samples are similar to that of the room-temperature implanted ones. Hot P implantation is demonstrated effectively in reducing ion implantation induced defect formation and suppressing nickel atoms diffusion. Therefore, hot P implantation is efficient in lowering junction leakage and excellent junction characteristics exhibiting \sim 1\times 10^{6}~{J}-{ \mathrm{\scriptscriptstyle ON}}/{J}-{ \mathrm{\scriptscriptstyle OFF}} ratio is achieved.
Original language | English |
---|---|
Article number | 7976289 |
Pages (from-to) | 1192-1195 |
Number of pages | 4 |
Journal | Ieee Electron Device Letters |
Volume | 38 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2017 |
Keywords
- Germanium
- hot implantation
- junction
- phosphorus