TY - GEN
T1 - Radio-frequency Superiority of Poly-Si TFTs with T-Shaped Gate and Air Spacers for IoT Applications
AU - Yang, Z. Y.
AU - Huang, Y. A.
AU - Lin, Horng-Chih
AU - Li, Pei-Wen
AU - Chen, K. M.
AU - Huang, G. W.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/7/26
Y1 - 2018/7/26
N2 - We report the first of its kind, self-organized poly-Si TFT structure of T-shaped silicided gate, air-spacers, as well as silicided source/drain in a single etching process followed by Ni self-aligned silicidation (SALICIDE) process. Process-controlled tunability of the T-shaped gate length and sidewall air-spacers have been demonstrated, enabling a practically achievable core building block for high-performance radio-frequency (RF) poly-Si TFTs. Detailed structural and electrical properties of the T-gate poly-Si TFTs were assessed using transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), and gate resistance, sidewall capacitance, as well as dc and RF measurements. Notably, unity-gain frequency of 12.1 GHz is recorded for our T-gate poly-Si TFTs with channel length of 96 nm.
AB - We report the first of its kind, self-organized poly-Si TFT structure of T-shaped silicided gate, air-spacers, as well as silicided source/drain in a single etching process followed by Ni self-aligned silicidation (SALICIDE) process. Process-controlled tunability of the T-shaped gate length and sidewall air-spacers have been demonstrated, enabling a practically achievable core building block for high-performance radio-frequency (RF) poly-Si TFTs. Detailed structural and electrical properties of the T-gate poly-Si TFTs were assessed using transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDS), and gate resistance, sidewall capacitance, as well as dc and RF measurements. Notably, unity-gain frequency of 12.1 GHz is recorded for our T-gate poly-Si TFTs with channel length of 96 nm.
KW - T-shaped gate
KW - internet of things
KW - radio-frequency
KW - selective etching
KW - thin-film transistor
UR - http://www.scopus.com/inward/record.url?scp=85051557390&partnerID=8YFLogxK
U2 - 10.1109/EDTM.2018.8421455
DO - 10.1109/EDTM.2018.8421455
M3 - Conference contribution
AN - SCOPUS:85051557390
SN - 9781538637111
T3 - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings
SP - 178
EP - 180
BT - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018
Y2 - 13 March 2018 through 16 March 2018
ER -