Abstract
RF performance comparison between InGaAs MOSFETs and ferroelectric field-effect transistors (FEFETs) as a function of channel length (Lch) is investigated using a technology computer-aided design (TCAD) simulator. The RF characteristics and energy efficiencies of FE-FETs are shown to have performance parity or even inferiority as compared with the conventional MOSFETs at relatively long Lch. However, as Lch scaled down, FE-FETs with substantial performance enhancement are observed. The highest improvement in unit gain cutoff frequency (fT) and maximum oscillation frequency (fMAX) is 15.4% (Lch = 75 nm) and 22.5% (Lch = 85 nm), respectively. In addition, for FE-FETs, device energy efficiencies are shown to achieve much higher improvement of 53.4% and 69.3% in transconductance generation factor (TGF) and transconductance frequencyproduct (TFP), respectively, at an optimizedLch of 15 nm. The superior RF properties obtained in FE-FETs can be attributed to the higher effective electron velocity (Veff), better gate controllability, and reduced gate resistance (Rg).
Original language | English |
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Pages (from-to) | 443-448 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 70 |
Issue number | 2 |
DOIs | |
State | Published - 1 Feb 2023 |
Keywords
- Ferroelectric (FE)
- InGaAs
- MOSFETs
- RF
- technology computer-aided design (TCAD)