Preventing Single-Event Double-Node Upsets by Engineering Change Order in Latch Designs

Sam M.H. Hsiao, Amy H.Y. Tsai, Lowry P.T. Wang, Aaron C.W. Liang, Charles H.P. Wen, Herming Chiueh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Single-event-induced soft errors are serious issues in advanced nano-scale technology, causing malfunctions in systems. As the size of technology node decreases to sub-65nm with closer transistor spacing, single-event double-node upsets (SEDU) occur more frequently than single-event upsets (SEU). Previous studies handled SEDU by incorporating protection mechanisms in cell designs or modifying the physical layout. However, they have massive area overhead and SEDU cannot be fully prevented. In this paper, we propose a LESER framework to reconstruct the latch design, achieving 100% SEDU tolerance. Based on the concept of engineering change order (ECO), LESER contains a two-level analysis process to prevent SEDU with minimum modification on layout, including 1) device level and 2) circuit level. The device level extracts the current source model by TCAD simulation and the circuit level reconstructs the layout with scanning process, double-node injection test, and layout modification approach. Experiments show that the reconstructed design can achieve a 100% soft error protection rate with the costs of an increment of 6.4% in area, 1% in timing and power penalty. The results indicate that LESER can fully prevent SEDU by reconstructing the latch with minimum performance penalties.

Original languageEnglish
Title of host publicationProceedings - 2023 IEEE International Test Conference, ITC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages276-284
Number of pages9
ISBN (Electronic)9798350343250
DOIs
StatePublished - 2023
Event2023 IEEE International Test Conference, ITC 2023 - Anaheim, United States
Duration: 7 Oct 202315 Oct 2023

Publication series

NameProceedings - International Test Conference
ISSN (Print)1089-3539

Conference

Conference2023 IEEE International Test Conference, ITC 2023
Country/TerritoryUnited States
CityAnaheim
Period7/10/2315/10/23

Keywords

  • radiation hardening
  • single-event double-node upset
  • single-event upset
  • soft error

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