@inproceedings{f7644095197740838f89550364b103f5,
title = "Practical Substrate Design Considering Symmetrical and Shielding Routes",
abstract = "In modern package design, the flip-chip package has become mainstream because of the benefit of its high I/O pins. However, the package design is still done manually in the industry. The lack of automation tools makes the package design cycle longer due to complex routing constraints, and the frequent modification requests. In this work, we propose yet another routing framework for substrate routing. Compared with previous works, our routing algorithm generates a feasible routing solution in a few seconds for industrial design and considers important symmetry and shielding constraints that have not been handled before. Benefiting from the efficiency of our routing algorithm, the designer can get the result immediately and accommodate some modifications to reduce the cost. The experimental result shows that the routing result generated from our router is in good quality, very close to the manual design.",
keywords = "area routing, shielding, substrate routing, symmetry",
author = "Chi, {Hao Yu} and Chen, {Simon Yi Hung} and Chen, {Hung Ming} and Liu, {Chien Nan} and Kuo, {Yun Chih} and Chang, {Ya Hsin} and Ho, {Kuan Hsien}",
note = "Publisher Copyright: {\textcopyright} 2022 EDAA.; 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022 ; Conference date: 14-03-2022 Through 23-03-2022",
year = "2022",
doi = "10.23919/DATE54114.2022.9774733",
language = "English",
series = "Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "951--956",
editor = "Cristiana Bolchini and Ingrid Verbauwhede and Ioana Vatajelu",
booktitle = "Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022",
address = "美國",
}