Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Tien Hung Lin; Po-Tsang Huang; Wei Hwang

doi:10.1109/SOCC.2010.5784737

Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Tien Hung Lin^*, Po-Tsang Huang, Wei Hwang

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.

Original language	English
Title of host publication	Proceedings - IEEE International SOC Conference, SOCC 2010
Pages	209-212
Number of pages	4
DOIs	https://doi.org/10.1109/SOCC.2010.5784737
State	Published - 1 Dec 2010
Event	23rd IEEE International SOC Conference, SOCC 2010 - Las Vegas, NV, United States Duration: 27 Sep 2010 → 29 Sep 2010

Publication series

Name	Proceedings - IEEE International SOC Conference, SOCC 2010

Conference

Conference	23rd IEEE International SOC Conference, SOCC 2010
Country/Territory	United States
City	Las Vegas, NV
Period	27/09/10 → 29/09/10

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10.1109/SOCC.2010.5784737

Cite this

@inproceedings{9192847d278742c78efe0038f9f8c70a,

title = "Power noise suppression technique using active decoupling capacitor for TSV 3D integration",

abstract = "In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.",

author = "Lin, {Tien Hung} and Po-Tsang Huang and Wei Hwang",

year = "2010",

month = dec,

day = "1",

doi = "10.1109/SOCC.2010.5784737",

language = "English",

isbn = "9781424466832",

series = "Proceedings - IEEE International SOC Conference, SOCC 2010",

pages = "209--212",

booktitle = "Proceedings - IEEE International SOC Conference, SOCC 2010",

note = "23rd IEEE International SOC Conference, SOCC 2010 ; Conference date: 27-09-2010 Through 29-09-2010",

}

Lin, TH, Huang, P-T & Hwang, W 2010, Power noise suppression technique using active decoupling capacitor for TSV 3D integration. in Proceedings - IEEE International SOC Conference, SOCC 2010., 5784737, Proceedings - IEEE International SOC Conference, SOCC 2010, pp. 209-212, 23rd IEEE International SOC Conference, SOCC 2010, Las Vegas, NV, United States, 27/09/10. https://doi.org/10.1109/SOCC.2010.5784737

Power noise suppression technique using active decoupling capacitor for TSV 3D integration. / Lin, Tien Hung; Huang, Po-Tsang; Hwang, Wei.
Proceedings - IEEE International SOC Conference, SOCC 2010. 2010. p. 209-212 5784737 (Proceedings - IEEE International SOC Conference, SOCC 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Power noise suppression technique using active decoupling capacitor for TSV 3D integration

AU - Lin, Tien Hung

AU - Huang, Po-Tsang

AU - Hwang, Wei

PY - 2010/12/1

Y1 - 2010/12/1

N2 - In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.

AB - In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.

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U2 - 10.1109/SOCC.2010.5784737

DO - 10.1109/SOCC.2010.5784737

M3 - Conference contribution

AN - SCOPUS:79960726095

SN - 9781424466832

T3 - Proceedings - IEEE International SOC Conference, SOCC 2010

SP - 209

EP - 212

BT - Proceedings - IEEE International SOC Conference, SOCC 2010

T2 - 23rd IEEE International SOC Conference, SOCC 2010

Y2 - 27 September 2010 through 29 September 2010

ER -

Power noise suppression technique using active decoupling capacitor for TSV 3D integration

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