@inproceedings{4b24cca1806c4f2eab81c8d2c759832b,
title = "Polymer TSV fabrication scheme with its electrical and reliability test vehicle",
abstract = "In this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated.",
author = "Lee, {Shih Wei} and Shih, {Jian Yu} and Chuang, {Ching Te} and Wei Hwang and Jin-Chern Chiou and Chen, {Kuo Hua} and Chiu, {Chi Tsung} and Kuan-Neng Chen",
year = "2015",
month = feb,
day = "24",
doi = "10.1109/IMPACT.2014.7048407",
language = "English",
series = "2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "282--285",
booktitle = "2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference",
address = "United States",
note = "null ; Conference date: 22-10-2014 Through 24-10-2014",
}