Permeation barrier coatings by inductively coupled plasma CVD on polycarbonate substrates for flexible electronic applications

Eddy Lay; Dong Sing Wuu; Shih Yung Lo; Ray-Hua Horng; Hsiao Fen Wei; Liang You Jiang; Hung Uang Lee; Yu Yang Chang

doi:10.1016/j.surfcoat.2011.03.037

Permeation barrier coatings by inductively coupled plasma CVD on polycarbonate substrates for flexible electronic applications

Eddy Lay, Dong Sing Wuu^*, Shih Yung Lo, Ray-Hua Horng, Hsiao Fen Wei, Liang You Jiang, Hung Uang Lee, Yu Yang Chang

^*Corresponding author for this work

Institute of Electronics

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

Silicon oxide (SiO_x)/silicon nitride (SiN_x) stacks and parylene thin films were deposited on flexible polycarbonate (PC) substrates using inductively coupled plasma chemical vapor deposition (ICPCVD) and a parylene reactor for permeation barrier applications. The effects of gas flow ratios on SiN_x and SiO_x film properties in terms of refractive index, internal stress, and water vapor transmission rate (WVTR) were investigated. It was found that the optical property and impermeability of SiN_x and SiO_x barrier films could be tailored by varying the gas flow ratio. The details of Ar plasma treatment effects on PC substrates in terms of contact angle, roughness, and WVTR were studied. The WVTR value of the optimum barrier structure (parylene+3 pairs of SiO_x/SiN_x) could reduce to 4.74×10^-5g/m²/day after bending for 1000 times under a resistivity test (25°C and 90% relative humidity). This result indicated that permeation barrier films prepared by ICPCVD could be a promising candidate for flexible electronic applications.

Original language	English
Pages (from-to)	4267-4273
Number of pages	7
Journal	Surface and Coatings Technology
Volume	205
Issue number	17-18
DOIs	https://doi.org/10.1016/j.surfcoat.2011.03.037
State	Published - 25 May 2011

Keywords

ICPCVD
Permeation
Polycarbonate
Silicon nitride
Silicon oxide

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@article{2c75adf3e7814bc5bc9b7bb1d4049c77,

title = "Permeation barrier coatings by inductively coupled plasma CVD on polycarbonate substrates for flexible electronic applications",

abstract = "Silicon oxide (SiOx)/silicon nitride (SiNx) stacks and parylene thin films were deposited on flexible polycarbonate (PC) substrates using inductively coupled plasma chemical vapor deposition (ICPCVD) and a parylene reactor for permeation barrier applications. The effects of gas flow ratios on SiNx and SiOx film properties in terms of refractive index, internal stress, and water vapor transmission rate (WVTR) were investigated. It was found that the optical property and impermeability of SiNx and SiOx barrier films could be tailored by varying the gas flow ratio. The details of Ar plasma treatment effects on PC substrates in terms of contact angle, roughness, and WVTR were studied. The WVTR value of the optimum barrier structure (parylene+3 pairs of SiOx/SiNx) could reduce to 4.74×10-5g/m2/day after bending for 1000 times under a resistivity test (25°C and 90\% relative humidity). This result indicated that permeation barrier films prepared by ICPCVD could be a promising candidate for flexible electronic applications.",

keywords = "ICPCVD, Permeation, Polycarbonate, Silicon nitride, Silicon oxide",

author = "Eddy Lay and Wuu, \{Dong Sing\} and Lo, \{Shih Yung\} and Ray-Hua Horng and Wei, \{Hsiao Fen\} and Jiang, \{Liang You\} and Lee, \{Hung Uang\} and Chang, \{Yu Yang\}",

year = "2011",

month = may,

day = "25",

doi = "10.1016/j.surfcoat.2011.03.037",

language = "English",

volume = "205",

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journal = "Surface and Coatings Technology",

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T1 - Permeation barrier coatings by inductively coupled plasma CVD on polycarbonate substrates for flexible electronic applications

AU - Lay, Eddy

AU - Wuu, Dong Sing

AU - Lo, Shih Yung

AU - Horng, Ray-Hua

AU - Wei, Hsiao Fen

AU - Jiang, Liang You

AU - Lee, Hung Uang

AU - Chang, Yu Yang

PY - 2011/5/25

Y1 - 2011/5/25

N2 - Silicon oxide (SiOx)/silicon nitride (SiNx) stacks and parylene thin films were deposited on flexible polycarbonate (PC) substrates using inductively coupled plasma chemical vapor deposition (ICPCVD) and a parylene reactor for permeation barrier applications. The effects of gas flow ratios on SiNx and SiOx film properties in terms of refractive index, internal stress, and water vapor transmission rate (WVTR) were investigated. It was found that the optical property and impermeability of SiNx and SiOx barrier films could be tailored by varying the gas flow ratio. The details of Ar plasma treatment effects on PC substrates in terms of contact angle, roughness, and WVTR were studied. The WVTR value of the optimum barrier structure (parylene+3 pairs of SiOx/SiNx) could reduce to 4.74×10-5g/m2/day after bending for 1000 times under a resistivity test (25°C and 90% relative humidity). This result indicated that permeation barrier films prepared by ICPCVD could be a promising candidate for flexible electronic applications.

AB - Silicon oxide (SiOx)/silicon nitride (SiNx) stacks and parylene thin films were deposited on flexible polycarbonate (PC) substrates using inductively coupled plasma chemical vapor deposition (ICPCVD) and a parylene reactor for permeation barrier applications. The effects of gas flow ratios on SiNx and SiOx film properties in terms of refractive index, internal stress, and water vapor transmission rate (WVTR) were investigated. It was found that the optical property and impermeability of SiNx and SiOx barrier films could be tailored by varying the gas flow ratio. The details of Ar plasma treatment effects on PC substrates in terms of contact angle, roughness, and WVTR were studied. The WVTR value of the optimum barrier structure (parylene+3 pairs of SiOx/SiNx) could reduce to 4.74×10-5g/m2/day after bending for 1000 times under a resistivity test (25°C and 90% relative humidity). This result indicated that permeation barrier films prepared by ICPCVD could be a promising candidate for flexible electronic applications.

KW - ICPCVD

KW - Permeation

KW - Polycarbonate

KW - Silicon nitride

KW - Silicon oxide

UR - https://www.scopus.com/pages/publications/79955113960

U2 - 10.1016/j.surfcoat.2011.03.037

DO - 10.1016/j.surfcoat.2011.03.037

M3 - Article

AN - SCOPUS:79955113960

SN - 0257-8972

VL - 205

SP - 4267

EP - 4273

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

IS - 17-18

ER -

Permeation barrier coatings by inductively coupled plasma CVD on polycarbonate substrates for flexible electronic applications

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