Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing

Keyphrases

• Abrasive Slurry 33%
• Abrasive-free Polishing 100%
• Adlayer 33%
• Benzotriazole 66%
• Copper Chemical Mechanical Polishing 33%
• Cu CMP 33%
• Cu Surface 33%
• Cu2+ Removal 66%
• Feature Design 33%
• Metal Oxide 33%
• Metal Removal Rate 33%
• Native Cu 33%
• Native Metals 33%
• Nitric Acid 33%
• Non-native 100%
• Pattern Effect 100%
• Removal Rate 66%
• Slurry 33%
• Surface Passivation 100%
• Surface Passivation Layer 33%

Engineering

• Chemical Mechanical Polishing 33%
• Cu Surface 33%
• Design Feature 33%
• Free Slurry 33%
• Metal Removal 33%
• Passivation 100%
• Passivation Layer 33%
• Removal Rate 100%

Material Science

• Chemical Mechanical Planarization 50%
• Metal Oxide 50%
• Polishing 100%
• Surface (Surface Science) 50%
• Surface Passivation 100%