@inproceedings{686fcc72ed0a4fa79571215d7a2b6e91,
title = "Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation",
abstract = "This paper investigates power MOSFET stress strategies for both package and chip aging evaluation. Two stress test methods are developed to speed up packaging and chip aging process respectively. As a result, the characteristics shifts of package and chip aging can be plotted independently. Thus, the measurement accuracy and measurement time can be improved. A test chip is designed and fabricated in a 0.15μm BCD process. The measured results demonstrate a 10kμm power MOSFET has Ron increased by 72% after 6.3hr stress for the package aging. For the chip aging, the MOSFET has Ron increased by 12% after 600 times stress pulses. The measurement verifies that the accelerated aging in the package and the chip can be controlled separately.",
keywords = "accelerated aging, accelerated testing, power MOSFET",
author = "Tingyou Lin and Chau-Chin Su and Chung-Chih Hung and Karuna Nidhi and Chily Tu and Huang, {Shao Chang}",
year = "2019",
month = may,
day = "14",
doi = "10.23919/DATE.2019.8714895",
language = "English",
series = "Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1661--1666",
booktitle = "Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019",
address = "美國",
note = "22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 ; Conference date: 25-03-2019 Through 29-03-2019",
}