Abstract
This letter discusses the reason for the instability of amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) under both positive and negative bias stresses. This instability is significantly influenced by the oxygen content in the bulk IGZO and the surrounding environment. The as-fabricated low-temperature devices can only endure a single polarized bias stress. An a-IGZO TFT that is stable toward both positive and negative bias stresses with large relaxation times of 95 \times 10} 4 and 371times 10 -4 respectively, is achieved by annealing and passivation.
Original language | English |
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Article number | 6026903 |
Pages (from-to) | 1552-1554 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 32 |
Issue number | 11 |
DOIs | |
State | Published - 1 Nov 2011 |
Keywords
- Bias stress
- IGZO
- Stability