Over-Voltage Protection on the CC Pin of USB Type-C Interface against Electrical Overstress Events

Chao Yang Ke, Ming Dou Ker

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In USB type-C interface, owing to the shrinking space between the pins of connector and the required high-power delivery, the electrical overstress (EOS) events due to some pins shorting to VBUS pin during plugging or unplugging operations had been reported. In this work, an over voltage protection (OVP) design on the CC pin of USB type-C IC was proposed, where a HVNMOS as a pass transistor was used to avoid the CC pin from EOS. An EOS detection circuit is proposed to turn off the gate of the HVNMOS when EOS stressing on the CC pin, which can mitigate the hot carrier degradation (HCD) of HVNMOS. Silicon chip fabricated in a 0.15-μm BCD technology has been measured to successfully verify the proposed OVP design in device level and circuit level.

Original languageEnglish
Title of host publication2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728131993
DOIs
StatePublished - 28 Apr 2020
Event2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Virtual, Online, United States
Duration: 28 Apr 202030 May 2020

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2020-April
ISSN (Print)1541-7026

Conference

Conference2020 IEEE International Reliability Physics Symposium, IRPS 2020
Country/TerritoryUnited States
CityVirtual, Online
Period28/04/2030/05/20

Keywords

  • electrical overstress (EOS)
  • hot carrier degradation (HCD)
  • over-voltage protection (OVP)
  • USB type-C

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