Optimizing Device Metal Routing Layouts by the Simulation Tool

Shao Chang Huang*, Ching Ho Li*, Chih Cherng Liao, Jung Tsun Chuang, Chien Wei Wang, Gong Kai Lin, Lin Fan Chen, Chun Chih Chen, Kuan I. Ho, Che Hua Chang, Hsiao Ying Yang, Chung Ren Lao, Jian Hsing Lee, Ke Horng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Device layout is very important for one Integrated Circuit (IC) performance. From different metal routing, ICs can own different achievements. In this study, simple device layouts with only two poly gate fingers are discovered for obtaining the optimizing device characteristics. In order to create the uniform current distributions, lots of metal routing segmentations are preferred, but many segmented metal layouts will induce less effective metal widths. Through the simulation tool, optimizing metal routing can be achieved. Finally, one suggested metal routing method for typical IC applications can be obtained from many simulation results.

Original languageEnglish
Title of host publication2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages219-220
Number of pages2
ISBN (Electronic)9798350324174
DOIs
StatePublished - 2023
Event2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Pingtung, Taiwan
Duration: 17 Jul 202319 Jul 2023

Publication series

Name2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023 - Proceedings

Conference

Conference2023 International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2023
Country/TerritoryTaiwan
CityPingtung
Period17/07/2319/07/23

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