Optimized layout on ESD protection diode with low parasitic capacitance

Chih Ting Yeh*, Ming-Dou Ker

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    2 Scopus citations

    Abstract

    The diode operated in forward-biased condition has been widely used as an effective on-chip electrostatic discharge (ESD) protection device at GHz RF and high-speed I/O pads in CMOS integrated circuits (ICs) due to the small parasitic loading effect and high ESD robustness. Based on waffle layout style, two modified layout styles have been proposed, which are called as multi-waffle and multi-waffle-hollow layout styles. Experimental results in a 90-nm CMOS process have confirmed that the figures of merit (FOMs) of ESD protection diodes with new proposed layout styles can be successfully improved.

    Original languageEnglish
    Title of host publicationICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings
    Pages1701-1703
    Number of pages3
    DOIs
    StatePublished - 1 Dec 2010
    Event2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Shanghai, China
    Duration: 1 Nov 20104 Nov 2010

    Publication series

    NameICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings

    Conference

    Conference2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
    Country/TerritoryChina
    CityShanghai
    Period1/11/104/11/10

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