TY - GEN
T1 - Optimized layout on ESD protection diode with low parasitic capacitance
AU - Yeh, Chih Ting
AU - Ker, Ming-Dou
PY - 2010/12/1
Y1 - 2010/12/1
N2 - The diode operated in forward-biased condition has been widely used as an effective on-chip electrostatic discharge (ESD) protection device at GHz RF and high-speed I/O pads in CMOS integrated circuits (ICs) due to the small parasitic loading effect and high ESD robustness. Based on waffle layout style, two modified layout styles have been proposed, which are called as multi-waffle and multi-waffle-hollow layout styles. Experimental results in a 90-nm CMOS process have confirmed that the figures of merit (FOMs) of ESD protection diodes with new proposed layout styles can be successfully improved.
AB - The diode operated in forward-biased condition has been widely used as an effective on-chip electrostatic discharge (ESD) protection device at GHz RF and high-speed I/O pads in CMOS integrated circuits (ICs) due to the small parasitic loading effect and high ESD robustness. Based on waffle layout style, two modified layout styles have been proposed, which are called as multi-waffle and multi-waffle-hollow layout styles. Experimental results in a 90-nm CMOS process have confirmed that the figures of merit (FOMs) of ESD protection diodes with new proposed layout styles can be successfully improved.
UR - http://www.scopus.com/inward/record.url?scp=78751486894&partnerID=8YFLogxK
U2 - 10.1109/ICSICT.2010.5667306
DO - 10.1109/ICSICT.2010.5667306
M3 - Conference contribution
AN - SCOPUS:78751486894
SN - 9781424457984
T3 - ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings
SP - 1701
EP - 1703
BT - ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings
T2 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
Y2 - 1 November 2010 through 4 November 2010
ER -