On Reliability Hardening of FPGA based RO-PUF by using Regression Methodologies

A. K. Asha, Abhishek Patyal, Hung Ming Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Physical Unclonable Function (PUF) is a rapidly growing hardware security primitive. In reconfigurable systems, applications requiring high security generate the secret keys using PUFs. Due to the limited control over an FPGA fabric, it is challenging to design a PUF with 100% reliability. In this work, we propose a novel method of improving the reliability of an RO PUF under varying operating temperature. We first analyze the impact of temperature on the device characteristics that are responsible for variations in the RO frequency by using linear and non-linear regression methodologies. Later, we use this knowledge to correct the output response bit flips to improve reliability. Our proposed method is evaluated on a large dataset of 50 Xilinx 28nm Artix-7 XC7A35T FPGAs, each containing 6592 ROs at six different operating temperatures. Our experiments prove that we can correct the unreliable key back to a reliable one, thus achieving a higher reliability at different operating temperatures.

Original languageEnglish
Title of host publication2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350334166
DOIs
StatePublished - 2023
Event2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Hsinchu, Taiwan
Duration: 17 Apr 202320 Apr 2023

Publication series

Name2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings

Conference

Conference2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023
Country/TerritoryTaiwan
CityHsinchu
Period17/04/2320/04/23

Keywords

  • Regression
  • Reliability
  • RO-PUF
  • Temperature

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