@inproceedings{a627f5dfb4694f98b6c9632cbf632812,
title = "On-Interposer Decoupling Capacitors Placement for Interposer-based 3DIC",
abstract = "With the demand for high performance and density, silicon interposer-based three-dimensional integrated circuit (3DIC) can be one of promising solutions for these requirements. However, simultaneously switching noise (SSN) will cause voltage fluctuation and hence performance degradation and logic failure might occur. Our work proposes an efficient Simulated Annealing (SA) based algorithm to perform decap placement automatically on the interposer. In our solution, target impedance can be achieved within certain frequency range. Results show that number of decaps as well as impedance of PDN are minimized to meet the requirement.",
author = "Chen, {Po Yang} and Liu, {Chang Yun} and Chen, {Hung Ming} and Huang, {Po Tsang}",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 24th International Symposium on Quality Electronic Design, ISQED 2023 ; Conference date: 05-04-2023 Through 07-04-2023",
year = "2023",
doi = "10.1109/ISQED57927.2023.10129288",
language = "English",
series = "Proceedings - International Symposium on Quality Electronic Design, ISQED",
publisher = "IEEE Computer Society",
booktitle = "Proceedings of the 24th International Symposium on Quality Electronic Design, ISQED 2023",
address = "United States",
}