On-chip self-calibrated process-temperature sensor for TSV 3D integration

Tzu Ting Chiang*, Po-Tsang Huang, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Wei Hwang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

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Keyphrases

Engineering

Material Science