Numerical modeling of interconnect flow channel design and thermal stress analysis of a planar anode-supported solid oxide fuel cell stack

S. S. Wei, T. H. Wang, Jong-Shinn Wu*

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    43 Scopus citations

    Abstract

    In this paper, we propose a new design of flow channel and stack arrangement based on the numerical study considering the effect of the flow channel design on the stack performance and analyze the thermal stress of a planar anode-supported solid oxide fuel cell stack. We also attempt to simplify the cell stack design without affecting its performance and propose an easier sealing method of cell stacks through the study of the thermal stress distribution. The results indicate that the new design, created by changing the cathode flow channel to a porous current collector, with a 6.3% increase in power density, an 8.6% increase in electrical efficiency. Both more uniform flow and current density distribution can be obtained as compared with a conventional counter-flow design. In addition, we propose a new design direction of cell stack, which could be simpler and easier to fabricate, in which material can easily undertake the resulting stress based on the thermal stress analysis.

    Original languageEnglish
    Pages (from-to)553-561
    Number of pages9
    JournalEnergy
    Volume69
    DOIs
    StatePublished - 1 May 2014

    Keywords

    • CFD
    • Interconnect
    • SOFC
    • Stack
    • Thermal stress

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