Novel mold-resistant building materials impregnated with thermally reduced nano-silver

Y. C. Chen; K. P. Yu; W. C. Shao; C. H. Tseng; W. C. Pan

doi:10.1111/ina.12443

Novel mold-resistant building materials impregnated with thermally reduced nano-silver

Y. C. Chen, K. P. Yu^*, W. C. Shao, C. H. Tseng, W. C. Pan

^*Corresponding author for this work

Institute of Environmental and Occupational Health Sciences

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

In this study, we evaluated the long-term antifungal effectiveness of 3 types of interior building materials (gypsum board [GB], cement board [CB], and softwood plywood [S-PW]) impregnated with thermally reduced silver nanoparticles supported by titanium dioxide (AgNPs/TiO₂) under 95% relative humidity for 4 weeks. AgNPs/TiO₂ was synthesized at 2 thermal reduction temperatures (TRTs, 120 and 200°C) with 2 different AgNP weight percentages (2 and 5 wt%). Four different silver-loading levels (SLLs, 0.025, 0.05, and 0.5 μg/cm² and the critical concentration required to inhibit fungal growth on agar plates) and 3 fungal species (Aspergillus niger, Penicillium spinulosum, and Stachybotrys chartarum) were used in the experiments. Higher temperature reduced more ionic Ag⁺ to metallic Ag⁰ and increased the dispersion of Ag on TiO₂ surface. The 200°C thermally reduced AgNPs/TiO₂ demonstrated excellent antifungal efficiency: Mold growth was almost completely inhibited for 28 days at the low SLL of 0.5 μg/cm². Additionally, AgNPs/TiO₂ exhibited higher antifungal activity on GB and CB than on S-PW. The stepwise regression results indicated that the TRT of AgNPs/TiO₂ (β = −0.739 to −0.51), the SLL (β = −0.477 to −0.269), and the Ag⁰ level in the AgNPs (β = −0.379 to −0.136) were the major factors influencing antifungal activity and TRT might be the most significant one.

Original language	English
Pages (from-to)	276-286
Number of pages	11
Journal	Indoor Air
Volume	28
Issue number	2
DOIs	https://doi.org/10.1111/ina.12443
State	Published - Mar 2018

Keywords

building materials
mold resistant
nano-silver
stepwise regression model
thermal reduction
titanium dioxide

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1111/ina.12443

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title = "Novel mold-resistant building materials impregnated with thermally reduced nano-silver",

abstract = "In this study, we evaluated the long-term antifungal effectiveness of 3 types of interior building materials (gypsum board [GB], cement board [CB], and softwood plywood [S-PW]) impregnated with thermally reduced silver nanoparticles supported by titanium dioxide (AgNPs/TiO2) under 95% relative humidity for 4 weeks. AgNPs/TiO2 was synthesized at 2 thermal reduction temperatures (TRTs, 120 and 200°C) with 2 different AgNP weight percentages (2 and 5 wt%). Four different silver-loading levels (SLLs, 0.025, 0.05, and 0.5 μg/cm2 and the critical concentration required to inhibit fungal growth on agar plates) and 3 fungal species (Aspergillus niger, Penicillium spinulosum, and Stachybotrys chartarum) were used in the experiments. Higher temperature reduced more ionic Ag+ to metallic Ag0 and increased the dispersion of Ag on TiO2 surface. The 200°C thermally reduced AgNPs/TiO2 demonstrated excellent antifungal efficiency: Mold growth was almost completely inhibited for 28 days at the low SLL of 0.5 μg/cm2. Additionally, AgNPs/TiO2 exhibited higher antifungal activity on GB and CB than on S-PW. The stepwise regression results indicated that the TRT of AgNPs/TiO2 (β = −0.739 to −0.51), the SLL (β = −0.477 to −0.269), and the Ag0 level in the AgNPs (β = −0.379 to −0.136) were the major factors influencing antifungal activity and TRT might be the most significant one.",

keywords = "building materials, mold resistant, nano-silver, stepwise regression model, thermal reduction, titanium dioxide",

author = "Chen, {Y. C.} and Yu, {K. P.} and Shao, {W. C.} and Tseng, {C. H.} and Pan, {W. C.}",

note = "Publisher Copyright: {\textcopyright} 2017 John Wiley & Sons A/S. Published by John Wiley & Sons Ltd",

year = "2018",

month = mar,

doi = "10.1111/ina.12443",

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T1 - Novel mold-resistant building materials impregnated with thermally reduced nano-silver

AU - Chen, Y. C.

AU - Yu, K. P.

AU - Shao, W. C.

AU - Tseng, C. H.

AU - Pan, W. C.

PY - 2018/3

Y1 - 2018/3

N2 - In this study, we evaluated the long-term antifungal effectiveness of 3 types of interior building materials (gypsum board [GB], cement board [CB], and softwood plywood [S-PW]) impregnated with thermally reduced silver nanoparticles supported by titanium dioxide (AgNPs/TiO2) under 95% relative humidity for 4 weeks. AgNPs/TiO2 was synthesized at 2 thermal reduction temperatures (TRTs, 120 and 200°C) with 2 different AgNP weight percentages (2 and 5 wt%). Four different silver-loading levels (SLLs, 0.025, 0.05, and 0.5 μg/cm2 and the critical concentration required to inhibit fungal growth on agar plates) and 3 fungal species (Aspergillus niger, Penicillium spinulosum, and Stachybotrys chartarum) were used in the experiments. Higher temperature reduced more ionic Ag+ to metallic Ag0 and increased the dispersion of Ag on TiO2 surface. The 200°C thermally reduced AgNPs/TiO2 demonstrated excellent antifungal efficiency: Mold growth was almost completely inhibited for 28 days at the low SLL of 0.5 μg/cm2. Additionally, AgNPs/TiO2 exhibited higher antifungal activity on GB and CB than on S-PW. The stepwise regression results indicated that the TRT of AgNPs/TiO2 (β = −0.739 to −0.51), the SLL (β = −0.477 to −0.269), and the Ag0 level in the AgNPs (β = −0.379 to −0.136) were the major factors influencing antifungal activity and TRT might be the most significant one.

AB - In this study, we evaluated the long-term antifungal effectiveness of 3 types of interior building materials (gypsum board [GB], cement board [CB], and softwood plywood [S-PW]) impregnated with thermally reduced silver nanoparticles supported by titanium dioxide (AgNPs/TiO2) under 95% relative humidity for 4 weeks. AgNPs/TiO2 was synthesized at 2 thermal reduction temperatures (TRTs, 120 and 200°C) with 2 different AgNP weight percentages (2 and 5 wt%). Four different silver-loading levels (SLLs, 0.025, 0.05, and 0.5 μg/cm2 and the critical concentration required to inhibit fungal growth on agar plates) and 3 fungal species (Aspergillus niger, Penicillium spinulosum, and Stachybotrys chartarum) were used in the experiments. Higher temperature reduced more ionic Ag+ to metallic Ag0 and increased the dispersion of Ag on TiO2 surface. The 200°C thermally reduced AgNPs/TiO2 demonstrated excellent antifungal efficiency: Mold growth was almost completely inhibited for 28 days at the low SLL of 0.5 μg/cm2. Additionally, AgNPs/TiO2 exhibited higher antifungal activity on GB and CB than on S-PW. The stepwise regression results indicated that the TRT of AgNPs/TiO2 (β = −0.739 to −0.51), the SLL (β = −0.477 to −0.269), and the Ag0 level in the AgNPs (β = −0.379 to −0.136) were the major factors influencing antifungal activity and TRT might be the most significant one.

KW - building materials

KW - mold resistant

KW - nano-silver

KW - stepwise regression model

KW - thermal reduction

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JO - Indoor Air

JF - Indoor Air

IS - 2

ER -

Novel mold-resistant building materials impregnated with thermally reduced nano-silver

Abstract

Keywords

UN SDGs

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