Novel Cu-to-Cu bonding with Ti passivation at 180^{\circ}{\rm C} in 3-D integration
- Yan Pin Huang
- , Yu San Chien
- , Ruoh Ning Tzeng
- , Ming Shaw Shy
- , Teu Hua Lin
- , Kou Hua Chen
- , Chi Tsung Chiu
- , Jin-Chern Chiou
- , Ching Te Chuang
- , Wei Hwang
- , Ho Ming Tong
- , Kuan-Neng Chen
Research output: Contribution to journal › Article › peer-review
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