Novel circuit-level model for gate oxide short and its testing method in SRAMs

Chen Wei Lin, Chia-Tso Chao, Chih Chieh Hsu

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


Gate oxide short (GOS) has become a common defect for advanced technologies as the gate oxide thickness of a MOSFET is greatly reduced. The behavior of a GOS-impacted MOSFET is, however, complicated and difficult to be accurately modeled at the circuit level. In this paper, we first build a golden model of a GOS-impacted MOSFET by using technology CAD, and identify the limitation and inaccuracy of the previous GOS models. Next, we propose a novel circuit-level GOS model which provides a higher accuracy of its dc characteristics than any of the previous models and being is able to represent a minimum-size GOS-impacted MOSFET. In addition, the proposed model can fit the transient characteristics of a GOS by considering the capacitance change of the GOS-impacted MOSFET, which has not been discussed in previous work. Last, we utilize our proposed GOS model to develop a novel GOS test method for SRAMs, which can effectively detect the GOS defects usually escaped from the conventional IDDQ test and March test.

Original languageEnglish
Article number6553093
Pages (from-to)1294-1307
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number6
StatePublished - Jun 2014


  • Defect modeling
  • SRAM
  • gate-oxide short
  • testing.


Dive into the research topics of 'Novel circuit-level model for gate oxide short and its testing method in SRAMs'. Together they form a unique fingerprint.

Cite this