Novel application of ring-oscillator-based sensor for 3D IC temperature and IR drop monitoring

Jin-Chern Chiou, Tzu Sen Yang, Shang Wei Tsai

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper proposes a novel method to clearly differentiate the distinct problems of temperature and IR drop inside a chip. This method involves the placement of two same ring-oscillator-based sensors in specific areas. Simulation results show that as temperature increases, the digital counter output of the ring-oscillator-based sensor decreases. Alternatively, a decrease in the power supply decreases the digital output of the ring-oscillator-based sensor. Results also show that when the digital circuit speed was slow, the difference between the digital count outputs of the two sensors became very small; this difference was very large when the speed was high. Thus, the difference between the digital count outputs of the two sensors represents the internal power status of the chip.

Original languageEnglish
Title of host publication2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781538612385
DOIs
StatePublished - 20 Jan 2018
Event2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, China
Duration: 14 Dec 201716 Dec 2017

Publication series

Name2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Volume2018-January

Conference

Conference2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Country/TerritoryChina
CityHaining, Zhejiang
Period14/12/1716/12/17

Keywords

  • 3d ic
  • ir drop
  • ring oscillator
  • temperature sensor

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