@inproceedings{f306bacc3608468abfaedbd81a5ee9ad,
title = "Novel application of ring-oscillator-based sensor for 3D IC temperature and IR drop monitoring",
abstract = "This paper proposes a novel method to clearly differentiate the distinct problems of temperature and IR drop inside a chip. This method involves the placement of two same ring-oscillator-based sensors in specific areas. Simulation results show that as temperature increases, the digital counter output of the ring-oscillator-based sensor decreases. Alternatively, a decrease in the power supply decreases the digital output of the ring-oscillator-based sensor. Results also show that when the digital circuit speed was slow, the difference between the digital count outputs of the two sensors became very small; this difference was very large when the speed was high. Thus, the difference between the digital count outputs of the two sensors represents the internal power status of the chip.",
keywords = "3d ic, ir drop, ring oscillator, temperature sensor",
author = "Jin-Chern Chiou and Yang, {Tzu Sen} and Tsai, {Shang Wei}",
year = "2018",
month = jan,
day = "20",
doi = "10.1109/EDAPS.2017.8277024",
language = "English",
series = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--3",
booktitle = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
address = "United States",
note = "null ; Conference date: 14-12-2017 Through 16-12-2017",
}