Noncontact Remote Doping for High-performance Two-dimensional Electronics

Po Heng Pao*, Ren Hao Cheng, Yi Hsiu Huang, Yu Ying Yang, Tzu Hsien Sang, Chia Ming Tsai, Chao Hsin Chien*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, a remote doping (RD) method is proposed in which SiOx is used as the remote doping agent without directly contacting transition metal dichalcogenide (TMD) materials. It is found that a doping density as high as 1.4 × 1013 cm-2 without reducing the mobility of the doped materials can be achieved and even after 1 month later the doping concentration remained as high as 1.2 × 1013 cm-2. We observe that SiOx is able to dope several popular 2D transition metal dichalcogenides, including MoS2, WS2, and WSe2. Notably, it possesses a lower k value than that of stoichiometric silicon dioxide oxide, which is very attractive for spacer doping in terms of the perspective of circuit operation. In our experiments, MoS2 and WS2 underlap top-gate devices exhibited 10× and 200× increases in their on-currents, respectively, after being doped with SiOx. These results indicate that SiOx doping can be implemented to manufacture high-performance 2D devices.

Original languageEnglish
Title of host publicationProceedings of 2023 IEEE 15th International Conference on ASIC, ASICON 2023
EditorsFan Ye, Ting-Ao Tang
PublisherIEEE Computer Society
ISBN (Electronic)9798350312980
DOIs
StatePublished - 2023
Event15th IEEE International Conference on ASIC, ASICON 2023 - Nanjing, China
Duration: 24 Oct 202327 Oct 2023

Publication series

NameProceedings of International Conference on ASIC
ISSN (Print)2162-7541
ISSN (Electronic)2162-755X

Conference

Conference15th IEEE International Conference on ASIC, ASICON 2023
Country/TerritoryChina
CityNanjing
Period24/10/2327/10/23

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