Fingerprint
Dive into the research topics of 'Non-destructive Observation of Void Formation Due to Electromigration in Solder Microbump by 3D X-ray'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Non-destructive Observation of Void Formation Due to Electromigration in Solder Microbump by 3D X-ray
Kai Cheng Shie, Tzu Wen Lin, King-Ning Tu, Chih Chen
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2
Scopus
citations