Abstract
Nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-Si gate to suppress the boron penetration for pMOS with the gate BF 2+ -implantation is proposed and demonstrated. The MOS capacitors fabricated by using this nitridized stacked poly-Si gate have better thermal stability and much improved electrical characteristics.
| Original language | English |
|---|---|
| Pages (from-to) | 248-249 |
| Number of pages | 2 |
| Journal | Ieee Electron Device Letters |
| Volume | 16 |
| Issue number | 6 |
| DOIs | |
| State | Published - Jun 1995 |