Abstract
Nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-Si gate to suppress the boron penetration for pMOS with the gate BF 2+ -implantation is proposed and demonstrated. The MOS capacitors fabricated by using this nitridized stacked poly-Si gate have better thermal stability and much improved electrical characteristics.
Original language | English |
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Pages (from-to) | 248-249 |
Number of pages | 2 |
Journal | IEEE Electron Device Letters |
Volume | 16 |
Issue number | 6 |
DOIs | |
State | Published - 1 Jan 1995 |