Nanometer-scale conversion of Si3N4 to SiOx

F. S.S. Chien, J. W. Chang, S. W. Lin, Y. C. Chou, T. T. Chen, S. Gwo*, Tien-Sheng Chao, W. F. Hsieh

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

84 Scopus citations


It has been found that atomic force microscope (AFM) induced local oxidation is an effective way for converting thin (<5 nm) Si3N4 films to SiOx. The threshold voltage for the 4.2 nm film is as low as 5 V and the initial growth rate is on the order of 103 nm/s at 10 V. Micro-Auger analysis of the selectively oxidized region revealed the formation of SiOx. Due to the large chemical selectivity in various etchants and great thermal oxidation rate difference between Si3N4, SiO2, and Si, AFM patterning of Si3N4 films can be a promising method for fabricating nanoscale structures.

Original languageEnglish
Pages (from-to)360-362
Number of pages3
JournalApplied Physics Letters
Issue number3
StatePublished - 17 Jan 2000


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