Motion of W marker during sequential compound formation in bimetallic AlCu thin films

H. T.G. Hentzell; R. D. Thompson; King-Ning Tu

doi:10.1016/0167-577X(83)90041-1

Motion of W marker during sequential compound formation in bimetallic AlCu thin films

H. T.G. Hentzell^*, R. D. Thompson, King-Ning Tu

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl₂, CuAl and Cu₉Al₄ intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl₂ between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl₂, Cu is the dominant diffusing species. However, for the formation of Cu₉Al₄ between Cu and CuAl, again both Cu and Al diffuse.

Original language	English
Pages (from-to)	81-84
Number of pages	4
Journal	Materials Letters
Volume	2
Issue number	2
DOIs	https://doi.org/10.1016/0167-577X(83)90041-1
State	Published - 1 Jan 1983

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title = "Motion of W marker during sequential compound formation in bimetallic AlCu thin films",

abstract = "Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse.",

author = "Hentzell, {H. T.G.} and Thompson, {R. D.} and King-Ning Tu",

year = "1983",

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T1 - Motion of W marker during sequential compound formation in bimetallic AlCu thin films

AU - Hentzell, H. T.G.

AU - Thompson, R. D.

AU - Tu, King-Ning

PY - 1983/1/1

Y1 - 1983/1/1

N2 - Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse.

AB - Discontinuous W films have been used as diffusion markers to study interdiffusion during the sequential formation of CuAl2, CuAl and Cu9Al4 intermetallic compounds in bimetallic Al and Cu thin films. Rutherford backscattering spectroscopy has been used to determine marker displacement. For the formation of CuAl2 between Cu and Al, both diffuse. For the formation of CuAl between Cu and CuAl2, Cu is the dominant diffusing species. However, for the formation of Cu9Al4 between Cu and CuAl, again both Cu and Al diffuse.

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U2 - 10.1016/0167-577X(83)90041-1

DO - 10.1016/0167-577X(83)90041-1

M3 - Article

AN - SCOPUS:0020832471

SN - 0167-577X

VL - 2

SP - 81

EP - 84

JO - Materials Letters

JF - Materials Letters

IS - 2

ER -

Motion of W marker during sequential compound formation in bimetallic AlCu thin films

Abstract

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