Abstract
The conventional segment-based OPC approach has been applied successfully for many CMOS generations and is currently favored. However, Inverse lithography technology (ILT) is a promising candidate for next-generation optical proximity correction (OPC). Still, there are issues that need to be thoroughly addressed and further optimized. In this work, we propose a model-based pre-OPC flow where the sizing of drawn patterns and placement of surrounding sub-resolution assist features (SRAF) are simultaneously generated in a single iteration using an ILT method. The complex patterns can then be simplified for a conventional OPC solution.
Original language | English |
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Article number | 714014 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 7140 |
DOIs | |
State | Published - 1 Dec 2008 |
Event | Lithography Asia 2008 - Taipei, Taiwan Duration: 4 Nov 2008 → 6 Nov 2008 |
Keywords
- Inverse lithography
- Optical proximity correction
- Sub-resolution assist features