Micro-moiré methods - Optical and scanning techniques

A. Asundi; H. Xie; C. Li; Gin Boay Chai Gin Boay; Kim Eng Oh Kim Eng

doi:10.1117/12.426994

Micro-moiré methods - Optical and scanning techniques

A. Asundi^*, H. Xie, C. Li, Gin Boay Chai Gin Boay, Kim Eng Oh Kim Eng

^*Corresponding author for this work

Institute of Lighting and Energy Photonics

Research output: Contribution to journal › Conference article › peer-review

5 Scopus citations

Abstract

Moiré method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moiré method and micro-moiré interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γ_xy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moiré and micro-moiré interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.

Original language	English
Pages (from-to)	54-57
Number of pages	4
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4416
DOIs	https://doi.org/10.1117/12.426994
State	Published - 2001
Event	Optical Engineering for Sensing and Nanotechnology (ICOSN 2001) - Yokohama, Japan Duration: 6 Jun 2001 → 8 Jun 2001

Keywords

AFM scanning moiré
Laser moiré interferometry
Method
Micro-deformation
Strain

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10.1117/12.426994

Cite this

@article{248482dd501544029c8b5b7ab0f48db3,

title = "Micro-moir{\'e} methods - Optical and scanning techniques",

abstract = "Moir{\'e} method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moir{\'e} method and micro-moir{\'e} interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γxy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moir{\'e} and micro-moir{\'e} interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.",

keywords = "AFM scanning moir{\'e}, Laser moir{\'e} interferometry, Method, Micro-deformation, Strain",

author = "A. Asundi and H. Xie and C. Li and {Chai Gin Boay}, {Gin Boay} and {Oh Kim Eng}, {Kim Eng}",

year = "2001",

doi = "10.1117/12.426994",

language = "English",

volume = "4416",

pages = "54--57",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Optical Engineering for Sensing and Nanotechnology (ICOSN 2001) ; Conference date: 06-06-2001 Through 08-06-2001",

}

TY - JOUR

T1 - Micro-moiré methods - Optical and scanning techniques

AU - Asundi, A.

AU - Xie, H.

AU - Li, C.

AU - Chai Gin Boay, Gin Boay

AU - Oh Kim Eng, Kim Eng

PY - 2001

Y1 - 2001

N2 - Moiré method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moiré method and micro-moiré interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γxy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moiré and micro-moiré interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.

AB - Moiré method is an effective way to measure full field deformation. In this paper, the atomic force microscope scanning moiré method and micro-moiré interferometry method are proposed to determine the deformation in micro-area. The measurement principle and techniques are discussed. The two methods are applied to measure thermal deformation in a BGA (ball grid array) electronic package component. The shear strain γxy at the solder site is determined. The experimental results including the adaptability of these two methods are compared and analyzed. The results show that AFM scanning moiré and micro-moiré interferometry methods are effective ways to measure the deformation in micro-area with high sensitivity.

KW - AFM scanning moiré

KW - Laser moiré interferometry

KW - Method

KW - Micro-deformation

KW - Strain

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U2 - 10.1117/12.426994

DO - 10.1117/12.426994

M3 - Conference article

AN - SCOPUS:0034878629

SN - 0277-786X

VL - 4416

SP - 54

EP - 57

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Optical Engineering for Sensing and Nanotechnology (ICOSN 2001)

Y2 - 6 June 2001 through 8 June 2001

ER -

Micro-moiré methods - Optical and scanning techniques

Abstract

Keywords

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