Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integrated interconnect application
- T. C. Chang*
- , T. M. Tsai
- , Po-Tsun Liu
- , S. T. Yan
- , Y. C. Chang
- , H. Aoki
- , S. M. Sze
- , Tseung-Yuen Tseng
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review