Method on surface roughness modification to alleviate stiction of microstructures

Cheng Chang Lee; Wen-Syang Hsu

doi:10.1116/1.1592809

Method on surface roughness modification to alleviate stiction of microstructures

Cheng Chang Lee^*, Wen-Syang Hsu

^*Corresponding author for this work

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

The methods on surface roughness modification to alleviate stiction of microstructures was discussed. Two kinds of surface roughness modification processes: spin-on photoresist and RIE process, were presented. The principle was based on an uneven etch of the photoresist by RIE, where the photoresist acted as the transferring template. It was found out that the modification process did not have to change the original fabrication process of the device and no extra mask was needed.

Original language	English
Pages (from-to)	1505-1510
Number of pages	6
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	21
Issue number	4
DOIs	https://doi.org/10.1116/1.1592809
State	Published - 1 Jul 2003

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title = "Method on surface roughness modification to alleviate stiction of microstructures",

abstract = "The methods on surface roughness modification to alleviate stiction of microstructures was discussed. Two kinds of surface roughness modification processes: spin-on photoresist and RIE process, were presented. The principle was based on an uneven etch of the photoresist by RIE, where the photoresist acted as the transferring template. It was found out that the modification process did not have to change the original fabrication process of the device and no extra mask was needed.",

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AB - The methods on surface roughness modification to alleviate stiction of microstructures was discussed. Two kinds of surface roughness modification processes: spin-on photoresist and RIE process, were presented. The principle was based on an uneven etch of the photoresist by RIE, where the photoresist acted as the transferring template. It was found out that the modification process did not have to change the original fabrication process of the device and no extra mask was needed.

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Method on surface roughness modification to alleviate stiction of microstructures

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