Abstract
High-performance TaN/TiLaO/La2O3SiO 2(111)-Ge nMOSFETs show high mobility of 432 cm2Vs at 1013cm-2 carrier density (Ns), good 1.05 junction ideality factor, and small subthreshold swing of 101 mV/dec, at a small 1.1-nm capacitance-equivalent thickness (CET). This is the first report of higher mobility in the Ge nMOSFET than SiO2Si universal mobility at wide medium-high Ns range and small CET of 1.1 nm, which is attributed to using the (111)-Ge substrate, 30-ns laser annealing, SiO 2 interfacial layer, and YbGexn-Ge contact.
Original language | English |
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Article number | 6403496 |
Pages (from-to) | 163-165 |
Number of pages | 3 |
Journal | Ieee Electron Device Letters |
Volume | 34 |
Issue number | 2 |
DOIs | |
State | Published - 2013 |
Keywords
- (111)
- Annealing
- Ge
- YbGe
- high-κ
- laser