Mems packaging

Keyphrases

• 3D Packaging 66%
• Academic Setting 33%
• Capping Process 33%
• Effective Integration 33%
• Electronic chip 33%
• Encapsulation Techniques 33%
• Functional Devices 33%
• Heterogeneous Integration 66%
• Industrial Setting 33%
• Introduction Chapters 33%
• MEMS Actuator 33%
• MEMS Devices 100%
• MEMS Packaging 66%
• MEMS Sensor 33%
• Microfluidics 33%
• Microspring 33%
• Motion Sensor 33%
• Printed Circuit Board Technology 33%
• Small Footprint 33%
• Smartphone 33%
• Solder Bonding 33%
• Through Silicon via 33%
• Vertical Interconnect 33%
• Wafer Level 33%
• Wafer-level Packaging 33%
• Wearable Electronics 33%

Material Science

• Actuator 9%
• Electronic Circuit 9%
• Microelectromechanical System 100%
• Silicon 9%