Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

Boris Hudec; Che-Chia Chang; Tuo-Hung Hou

doi:10.1109/ICSICT.2018.8564975

Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

Boris Hudec^*, Che-Chia Chang, Tuo-Hung Hou

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)
Editors	YL Jiang, TA Tang, F Ye
Publisher	IEEE
Chapter	S36-3
Pages	863-863
Number of pages	1
DOIs	https://doi.org/10.1109/ICSICT.2018.8564975
State	Published - 31 Oct 2018
Event	14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao Duration: 31 Oct 2018 → 3 Nov 2018

Conference

Conference	14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
City	Qingdao
Period	31/10/18 → 3/11/18

Access to Document

10.1109/ICSICT.2018.8564975

Cite this

Hudec, B., Chang, C.-C., & Hou, T.-H. (2018). Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications. In YL. Jiang, TA. Tang, & F. Ye (Eds.), 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) (pp. 863-863). Article 8564975 IEEE. https://doi.org/10.1109/ICSICT.2018.8564975

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title = "Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications",

author = "Boris Hudec and Che-Chia Chang and Tuo-Hung Hou",

year = "2018",

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doi = "10.1109/ICSICT.2018.8564975",

language = "English",

pages = "863--863",

editor = "YL Jiang and TA Tang and F Ye",

booktitle = "2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)",

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note = "14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) ; Conference date: 31-10-2018 Through 03-11-2018",

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Hudec, B, Chang, C-C & Hou, T-H 2018, Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications. in YL Jiang, TA Tang & F Ye (eds), 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)., 8564975, IEEE, pp. 863-863, 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Qingdao, 31/10/18. https://doi.org/10.1109/ICSICT.2018.8564975

Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications. / Hudec, Boris; Chang, Che-Chia; Hou, Tuo-Hung.
2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT). ed. / YL Jiang; TA Tang; F Ye. IEEE, 2018. p. 863-863 8564975.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Memristive devices by ALD

T2 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

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AU - Chang, Che-Chia

AU - Hou, Tuo-Hung

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DO - 10.1109/ICSICT.2018.8564975

M3 - Conference contribution

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EP - 863

BT - 2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)

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A2 - Tang, TA

A2 - Ye, F

PB - IEEE

Y2 - 31 October 2018 through 3 November 2018

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