Mechanical strengthening of nanotwinned Cu films with Ag solid solution

Kang Ping Lee, Dinh Phuc Tran, Fu Chian Chen, Wei You Hsu, Yi Quan Lin, Hung Che Liu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This study employs Ag solid solution to enhance the mechanical strength of nanotwinned copper (nt-Cu) films. We deposited a thin silver layer onto the nt-Cu film and annealed it at low temperatures. Depth profile reveals that Ag atoms diffused 100 nm after annealing. The Ag atoms interdiffused into nt-Cu film and strengthened it. A significant enhancement in hardness (45.9%) was obtained using the Ag layer and heat treatment. This could be attributed to the Ag diffusion, grain boundary segregation, and twin density increase. The study delivers a pioneer approach to strengthen the nt-Cu films.

Original languageEnglish
Article number131775
JournalMaterials Letters
Volume313
DOIs
StatePublished - 15 Apr 2022

Keywords

  • Diffusion
  • Grain boundaries
  • Hardness
  • Nanotwinned copper-silver

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