Mechanical strengthening of nanotwinned Cu films with Ag solid solution

Kang Ping Lee; Dinh Phuc Tran; Fu Chian Chen; Wei You Hsu; Yi Quan Lin; Hung Che Liu; Chih Chen

doi:10.1016/j.matlet.2022.131775

Mechanical strengthening of nanotwinned Cu films with Ag solid solution

Kang Ping Lee, Dinh Phuc Tran, Fu Chian Chen, Wei You Hsu, Yi Quan Lin, Hung Che Liu, Chih Chen^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

This study employs Ag solid solution to enhance the mechanical strength of nanotwinned copper (nt-Cu) films. We deposited a thin silver layer onto the nt-Cu film and annealed it at low temperatures. Depth profile reveals that Ag atoms diffused 100 nm after annealing. The Ag atoms interdiffused into nt-Cu film and strengthened it. A significant enhancement in hardness (45.9%) was obtained using the Ag layer and heat treatment. This could be attributed to the Ag diffusion, grain boundary segregation, and twin density increase. The study delivers a pioneer approach to strengthen the nt-Cu films.

Original language	English
Article number	131775
Journal	Materials Letters
Volume	313
DOIs	https://doi.org/10.1016/j.matlet.2022.131775
State	Published - 15 Apr 2022

Keywords

Diffusion
Grain boundaries
Hardness
Nanotwinned copper-silver

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title = "Mechanical strengthening of nanotwinned Cu films with Ag solid solution",

abstract = "This study employs Ag solid solution to enhance the mechanical strength of nanotwinned copper (nt-Cu) films. We deposited a thin silver layer onto the nt-Cu film and annealed it at low temperatures. Depth profile reveals that Ag atoms diffused 100 nm after annealing. The Ag atoms interdiffused into nt-Cu film and strengthened it. A significant enhancement in hardness (45.9%) was obtained using the Ag layer and heat treatment. This could be attributed to the Ag diffusion, grain boundary segregation, and twin density increase. The study delivers a pioneer approach to strengthen the nt-Cu films.",

keywords = "Diffusion, Grain boundaries, Hardness, Nanotwinned copper-silver",

author = "Lee, {Kang Ping} and Tran, {Dinh Phuc} and Chen, {Fu Chian} and Hsu, {Wei You} and Lin, {Yi Quan} and Liu, {Hung Che} and Chih Chen",

note = "Publisher Copyright: {\textcopyright} 2022 Elsevier B.V.",

year = "2022",

month = apr,

day = "15",

doi = "10.1016/j.matlet.2022.131775",

language = "English",

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journal = "Materials Letters",

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T1 - Mechanical strengthening of nanotwinned Cu films with Ag solid solution

AU - Lee, Kang Ping

AU - Tran, Dinh Phuc

AU - Chen, Fu Chian

AU - Hsu, Wei You

AU - Lin, Yi Quan

AU - Liu, Hung Che

AU - Chen, Chih

PY - 2022/4/15

Y1 - 2022/4/15

N2 - This study employs Ag solid solution to enhance the mechanical strength of nanotwinned copper (nt-Cu) films. We deposited a thin silver layer onto the nt-Cu film and annealed it at low temperatures. Depth profile reveals that Ag atoms diffused 100 nm after annealing. The Ag atoms interdiffused into nt-Cu film and strengthened it. A significant enhancement in hardness (45.9%) was obtained using the Ag layer and heat treatment. This could be attributed to the Ag diffusion, grain boundary segregation, and twin density increase. The study delivers a pioneer approach to strengthen the nt-Cu films.

AB - This study employs Ag solid solution to enhance the mechanical strength of nanotwinned copper (nt-Cu) films. We deposited a thin silver layer onto the nt-Cu film and annealed it at low temperatures. Depth profile reveals that Ag atoms diffused 100 nm after annealing. The Ag atoms interdiffused into nt-Cu film and strengthened it. A significant enhancement in hardness (45.9%) was obtained using the Ag layer and heat treatment. This could be attributed to the Ag diffusion, grain boundary segregation, and twin density increase. The study delivers a pioneer approach to strengthen the nt-Cu films.

KW - Diffusion

KW - Grain boundaries

KW - Hardness

KW - Nanotwinned copper-silver

UR - http://www.scopus.com/inward/record.url?scp=85123684261&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2022.131775

DO - 10.1016/j.matlet.2022.131775

M3 - Article

AN - SCOPUS:85123684261

VL - 313

JO - Materials Letters

JF - Materials Letters

SN - 0167-577X

M1 - 131775

ER -

Mechanical strengthening of nanotwinned Cu films with Ag solid solution

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Keywords

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