Keyphrases
Thermal Stability
100%
Material Characteristics
100%
Resistivity
66%
Heater
66%
Thermal Cycling
66%
Ru-content
66%
Si Substrate
33%
Transmission Electron Microscopy
33%
X-ray Photoelectron Spectroscopy
33%
High Temperature
33%
Electron Microscopy Examination
33%
Compressive Stress
33%
Oxidation Resistance
33%
Temperature Behavior
33%
Atomic Ratio
33%
Good Stability
33%
Stress Temperature
33%
Energy Transport
33%
Stress Stability
33%
Oxygen Content
33%
Alloy Composition
33%
Composition Ranges
33%
Auger Depth Profiling
33%
Metallic State
33%
Surface Oxide
33%
Stress Increment
33%
Printhead
33%
Alloy Films
33%
Co-sputtering
33%
Structure Stability
33%
Depth Profiling Analysis
33%
Driving Pulse
33%
Ru Atoms
33%
Thermodynamic Calculation
33%
Preferential Oxidation
33%
Measured Stress
33%
Infinite Reservoir
33%
Thermal Inkjet
33%
Liquid Pool
33%
Momentum Transport
33%
Thin-film Heaters
33%
Pooled Testing
33%
Engineering
Thin Films
100%
Material Characteristic
100%
Phase Composition
75%
Si Substrate
25%
Ray Photoelectron Spectroscopy
25%
Compressive Stress
25%
Temperature Behavior
25%
Energy Transport
25%
Thermal Cycle
25%
Alloy Composition
25%
Oxygen Content
25%
Surface Oxide
25%
Oxidation Resistance
25%
Oxidized Si
25%
Thermodynamic Calculation
25%
Test Environment
25%
Liquid Pool
25%
Printhead
25%
Momentum Transport
25%
Preferential Oxidation
25%
Material Science
Thin Films
100%
Thermal Stability
100%
Phase Composition
100%
Film
75%
Electrical Resistivity
50%
Oxidation Reaction
50%
Transmission Electron Microscopy
25%
Oxidation Resistance
25%
Oxide Surface
25%
Photoemission Spectroscopy
25%
Thermal Cycling
25%
Physics
Thin Films
100%
Photoelectron Spectroscopy
25%
Transmission Electron Microscopy
25%
Oxidation Resistance
25%
Chemical Engineering
Film
100%
Thermal Cycling
14%