Magnetic analysis of a micromachined magnetic actuator using the finite element method

C. H. Ko*, J. J. Yang, Jin-Chern Chiou, S. C. Chen, T. H. Kao

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations

Abstract

In this paper, a parametrical method is developed to design a magnetic microactuator. The method is based on modeling the magnetic microactuator using the finite element analysis software that can be used to calculate the energy density and magnetic force. Here, the concept of design on experiments (DOE) is used to identify critical parameters that affect the performances of the electromagnetic microactuator. Numerical simulation results from a series of DOE have indicated that the dimension of core and the magnetic material block have the influence on planar electromagnetic actuators. When the length of the magnetic components is equal to that of outer diameter of coil circuit, we obtain the best efficiency in magnetic force. Furthermore, when we increase the thickness of the magnetic materials block or shorten the distance between the coils and magnetic material block, the magnetic force will increase dramatically. In addition, we can achieve a great magnetic force when the combination ratio of the length of the core is half of the magnetic material block. Simulation results have shown that electromagnetic actuators with high aspect ratio planar coil could sustain higher electrical current that consequently increases the magnetic force. During the realistic fabrication, the thick resist patterning and electroplating technologies is used to fabricate the above-mentioned electromagnetic microactuator. Experimental results indicated that the magnetic force follows closely to the simulation results.

Original languageEnglish
Pages (from-to)127-136
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3893
DOIs
StatePublished - 1 Dec 1999
EventProceedings of the 1999 Design, Characterization, and Packaging for MEMS and Microelectronics - Royal Pines Resort, Aust
Duration: 27 Oct 199929 Oct 1999

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