Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Kai Ming Yang, Tzu Chieh Chou, Cheng Ta Ko, Chen Hao Lin, Yu Hua Chen, Tzyy Jang Tseng, Wen Wei Wu, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In this paper, low temperature (190-220°C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP).

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages10
Number of pages1
ISBN (Electronic)9784904743072
DOIs
StatePublished - 21 May 2019
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 21 May 201925 May 2019

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country/TerritoryJapan
CityKanazawa, Ishikawa
Period21/05/1925/05/19

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