Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng, Yan Pin Huang, Yu San Chien, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

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Engineering & Materials Science