Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng; Yan Pin Huang; Yu San Chien; Ching Te Chuang; Wei Hwang; Jin-Chern Chiou; Ming Shaw Shy; Teu Hua Lin; Kou Hua Chen; Chi Tsung Chiu; Ho Ming Tong; Kuan-Neng Chen

doi:10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

Ruoh Ning Tzeng, Yan Pin Huang, Yu San Chien, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

Original language	English
Title of host publication	Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
DOIs	https://doi.org/10.1109/IITC.2013.6615572
State	Published - 2013
Event	2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan Duration: 13 Jun 2013 → 15 Jun 2013

Publication series

Name	Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Conference

Conference	2013 16th IEEE International Interconnect Technology Conference, IITC 2013
Country/Territory	Japan
City	Kyoto
Period	13/06/13 → 15/06/13

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10.1109/IITC.2013.6615572

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Tzeng, R. N., Huang, Y. P., Chien, Y. S., Chuang, C. T., Hwang, W., Chiou, J.-C., Shy, M. S., Lin, T. H., Chen, K. H., Chiu, C. T., Tong, H. M., & Chen, K.-N. (2013). Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. In Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013 Article 6615572 (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013). https://doi.org/10.1109/IITC.2013.6615572

@inproceedings{c1211c29fe2b4871a09aade347891e1e,

title = "Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications",

abstract = "A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.",

author = "Tzeng, {Ruoh Ning} and Huang, {Yan Pin} and Chien, {Yu San} and Chuang, {Ching Te} and Wei Hwang and Jin-Chern Chiou and Shy, {Ming Shaw} and Lin, {Teu Hua} and Chen, {Kou Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",

year = "2013",

doi = "10.1109/IITC.2013.6615572",

language = "English",

isbn = "9781479904396",

series = "Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013",

booktitle = "Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013",

note = "2013 16th IEEE International Interconnect Technology Conference, IITC 2013 ; Conference date: 13-06-2013 Through 15-06-2013",

}

Tzeng, RN, Huang, YP, Chien, YS, Chuang, CT, Hwang, W, Chiou, J-C, Shy, MS, Lin, TH, Chen, KH, Chiu, CT, Tong, HM & Chen, K-N 2013, Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. in Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013., 6615572, Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013, 2013 16th IEEE International Interconnect Technology Conference, IITC 2013, Kyoto, Japan, 13/06/13. https://doi.org/10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. / Tzeng, Ruoh Ning; Huang, Yan Pin; Chien, Yu San et al.
Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 2013. 6615572 (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

AU - Tzeng, Ruoh Ning

AU - Huang, Yan Pin

AU - Chien, Yu San

AU - Chuang, Ching Te

AU - Hwang, Wei

AU - Chiou, Jin-Chern

AU - Shy, Ming Shaw

AU - Lin, Teu Hua

AU - Chen, Kou Hua

AU - Chiu, Chi Tsung

AU - Tong, Ho Ming

AU - Chen, Kuan-Neng

PY - 2013

Y1 - 2013

N2 - A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

AB - A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.

UR - http://www.scopus.com/inward/record.url?scp=84886716441&partnerID=8YFLogxK

U2 - 10.1109/IITC.2013.6615572

DO - 10.1109/IITC.2013.6615572

M3 - Conference contribution

AN - SCOPUS:84886716441

SN - 9781479904396

T3 - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

BT - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

T2 - 2013 16th IEEE International Interconnect Technology Conference, IITC 2013

Y2 - 13 June 2013 through 15 June 2013

ER -

Tzeng RN, Huang YP, Chien YS, Chuang CT, Hwang W, Chiou JC et al. Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications. In Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 2013. 6615572. (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013). doi: 10.1109/IITC.2013.6615572

Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications

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