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Low-temperature bonded Cu/In interconnect with high thermal stability for 3-D integration
Yu San Chien, Yan Pin Huang, Ruoh Ning Tzeng, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Chi Tsung Chiu, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho Ming Tong, Kuan-Neng Chen
Research output: Contribution to journal › Article › peer-review
13
Scopus
citations